Chemical tin protects against oxidation

Chemical tin is an important process in the surface treatment of printed circuit boards. In this process, a thin layer of tin coats the copper surface of the PCB. This layer protects the copper from oxidation and corrosion. The use of the chemical-tin process significantly improves solderability and durability at the solder joints of the PCB. As a central process in PCB manufacturing, it is of paramount importance for reliability and performance, especially in the electronics industry.  
Chemical-tin systems from TSK impress with their maximum reliability and durability. 

• Improved solderability for better connection between components 
• Reduction of defective solder joints  
• improves electrical conductivity   
• Uniform coating for optimal adhesion  

All-round carefree service

To ensure that our machines continue to work perfectly even after many years, we offer our customers a high-performance and experienced service. Whether maintenance, wear, repair or modernization, the TSK service ensures reliable production at all times. 
In addition, we also take care of machines for horizontal wet chemical processes that do not come from our company. Feel free to ask us!  

Careful control of chemical processes

The chemical-tin process takes place in several steps. First, the copper surface is prepared and cleaned. This cleaning removes contaminants such as grease, dust, and oxidation that can affect the adhesion of the tin. Thorough cleaning is essential for the subsequent success of the procedure.   
The core of the process is then carried out by treating the printed circuit boards with a chemical tin solution of tin salts. During this step, the tin is deposited evenly on the copper surface. The deposition takes place via chemical reactions, which must be carefully controlled. Both temperature and time affect the thickness of the layer and its quality. If this process step is carried out at excessively high temperatures, the layer can become uneven. Treatment times that are too short will result in a tin layer that is too thin. Both reduce the quality of the printed circuit boards. 

Chemically controlling tin safely

In surface processing, the chemical-tin process also has some limitations. This allows the tin layer to react sensitively to mechanical stresses. Tin layers that are too thick could become brittle and affect the reliability of the PCB. Last but not least, handling a chemical tin solution requires careful control to avoid environmental damage. 

Highest quality for chemical-tin processes

Overall, the chemical-tin process is indispensable in the surface processing of printed circuit boards because it significantly improves the quality and reliability of printed circuit boards. Carried out with care, the process ensures that printed circuit boards are optimally prepared for subsequent soldering processes.   
As a plant manufacturer, TSK ensures that PCB manufacturers in the electronics industry meet the highest quality standards. 

Continuously refining technologies

For TSK, the state of the art is always only the basis and starting point for making further technological advances and refining technologies. In doing so, we always keep in mind that our systems are easy to maintain and robust in order to reliably maintain production. Resource conservation and environmental friendliness, wastewater-saving circuits, emissions into the air and noise emissions are just as important to us as the production quality for which the machines were designed. We support our customers in obtaining operator approvals for the processes on site.