Perfect direct plating

Contacting through in horizontal wet chemical processes makes it possible to electrically connect the copper layers of a printed circuit board. This process requires precise engineering and modern equipment to achieve the highest quality, so that the conductive copper layer penetrates the bores precisely and thus ensures a reliable connection. TSK specialises in high-quality technology for reliable and perfectly working machines that guarantee clean and, above all, reliable through-contacting. With our technical expertise, we ensure excellent process control. 

• Precise process control for uniform copper layers 
• High cleaning performance before plating 
• Efficient deposition of the conductive layer 
• Sustainable use of chemicals 

All-round carefree service

To ensure that our machines continue to work perfectly even after many years, we offer our customers a high-performance and experienced service. Whether maintenance, wear, repair or modernization, the TSK service ensures reliable production at all times. 
In addition, we also take care of machines for horizontal wet chemical processes that do not come from our company. Feel free to ask us!  

Extraordinary process control

Our excellent process control is based on flooding processes in order to be able to carry out chemical hole treatments at the depth of the boreholes. Printed circuit boards have an insulator installed between each electrically conductive layer, which also forms the carrier layer of the copper foils. In order for the upper copper layer to be electrically connected to the lower copper layer, the hole must be made electrically conductive after the drilling process. The same applies to multilayers: Here, the outer contact layer can be contacted with the inner layers. To do this, the borehole is first cleaned (desmear) in order to make the insulator conductive at the front side of the borehole in the next step. Electrical conductivity is also produced with special wet chemicals. 

Common contacting processes

The most common procedures and processes that TSK offers in its portfolio are electroless copper, coal (Shadow, Blackhole*) and polymerization (Envision*). Regardless of which contacting process is used, borehole cleaning is necessary in any case and always upstream before plating through hole.  

Chemisch Kupfer (electroless copper) 

After the borehole cleaning, all oxidation on the copper is removed, the surfaces are conditioned and the chemical copper is applied in the further run. This closes the conductive layer over the insulator, which allows a cathode current to be applied to the copper in the electroplating shop. 

Coal (Shadow, Blackhole*)

After the borehole cleaning, all oxidation on the copper is removed, the surfaces are conditioned and the chemically dissolved coal is applied in the borehole, which combines from colloidal particles to form a closed surface. After the coal has been applied, the thin layer is stabilized by means of a catalyst. This closes the conductive layer over the insulator, which allows a cathode current to be applied to the copper in the electroplating shop. 

Polymerisation (Envision*)

After the borehole cleaning, all oxidation on the copper is removed, the surfaces are conditioned and permanganate is applied in the borehole in the run. After rinsing, a catalyst is applied wet-in-wet, which forms a polymer together with the manganate. This closes the conductive layer over the insulator, which allows a cathode current to be applied to the copper in the electroplating shop. 

Exclusive flooding technology

Due to TSK’s many years of experience in plant engineering for PCB production and its many years of expertise, we have developed a convincing and reliable machine technology that represents considerable added value for our customers. Machine availability, homogeneous flooding technologies and equally reliable flushing between the process stages ensure the highest quality in borehole cleaning and borehole occupancy. 

The core element, the flooding technology, guarantees that all common base materials are reliably processed and processed in conjunction with chemistry. In addition to the machine design and design, the most important thing in all processes is to continuously analyze the chemistry precisely and to control the dosing concepts just as precisely. Only reliable regeneration in the process ensures consistent quality in production.  in der Produktion.  

Continuously refining technologies

For TSK, the state of the art is always only the basis and starting point for making further technological advances and refining technologies. In doing so, we always keep in mind that our systems are easy to maintain and robust in order to reliably maintain production. Resource conservation and environmental friendliness, wastewater-saving circuits, emissions into the air and noise emissions are just as important to us as the production quality for which the machines were designed. We support our customers in obtaining operator approvals for the processes on site. 

 

* Product names of chemical suppliers