Precise and efficient etching

TSK manufactures systems for the three different etching processes alkaline, acidic and FeCl₃ etching. The most common etching process is acid etching based on copper chloride (CuCl₂), which we offer in combination with vacuum suction. For outer layer production, we also recommend vacuum etching support in addition to the alkaline ammonia-based etching systems. Molding etching (chemical milling) is based on iron-3-chloride FeCl₃. We offer all common analytical methods for the etching machines in order to keep the chemistry at its most efficient efficiency. 

• High precision in etching 
• High CPk values on etched structures.  
• Efficient, precise analysis and control of different etching solutions 
• Safer and more precise manufacturing processes in various industries 

All-round carefree service

To ensure that our machines continue to work perfectly even after many years, we offer our customers a high-performance and experienced service. Whether maintenance, wear, repair or modernization, the TSK service ensures reliable production at all times. 
In addition, we also take care of machines for horizontal wet chemical processes that do not come from our company. Feel free to ask us!  

Acid etching: short-circuit-free and homogeneous

Acid etching removes the copper that was exposed during the development process. A sprayed chemical solution will only absorb fresh copper until it is saturated. Copper is etched into depth to the base material where the PCB needs the insulator to the adjacent copper structure. This prevents short circuits between the lanes. The copper is removed down to the base material at very high etching rates, so that the traces remain visible under the remaining resist. 

In order to achieve maximum homogeneity in the X and Y directions as well as in the depth (Z) on the PCB, we offer the etching process with vacuum suction. It controls the uncontrolled outflow of the etching medium and minimizes under-etching. This precision is particularly important for fine structures, so that cross-sections remain process-stable for high-frequency applications and for applications at high currents. 

Alkaline etching: highly precise and effective

In alkaline etching, an ammonia-based etching solution is used instead of CuCl₂ (copper chloride). This method is often used for etching outer layers because the etching resist on these layers is made of tin. The alkaline solution makes it possible to effectively remove copper while ensuring a clean result. This process is particularly suitable for applications where high-precision results are required in PCB construction. 

In order to achieve maximum homogeneity in the X and Y directions as well as in the depth (Z) on the PCB, we offer the etching process with vacuum suction. It controls the uncontrolled outflow of the etching medium and minimizes under-etching. This precision is particularly important for fine structures, so that cross-sections remain process-stable for high-frequency applications and for applications at high currents. 

FeCl₃ etching: rolling razor-sharp

Specializing in the etching of rolling dies matrix’s, we know the problem with etched and depositing carbon. Our processes ensure precision in metal removal and in the production of razor-sharp edges. This method is suitable for producing high-precision parts, such as scalpel blades as well as components for medicine, cosmetics, electronics or printing processes. 

In addition to our etching machines, we offer all common analysis methods. In this way, we keep the chemistry at its most efficient efficiency. 

Innovative nozzle stock cleaning

Spray manifolds with its nozzles in etching machines are the core of the etching process and are contaminated with chemicals inside and out. For a homogeneous spray pattern, the nozzles are arranged in such a way that they etch overlapping. Whether nozzles are clogged or damaged is not visible in the process. Regular preventive maintenance is therefore indispensable for process reliability, but unfortunately also unpleasant, as it noticeably costs resources.  
 
TSK has therefore invested in a sustainable and cost-effective solution to make cleaning as easy and fast as possible. The result is our innovative spary manifold cleaning booth. The nozzle hives can be clamped in specially designed cleaning chambers and cleaned with water. The rinse water is stored in a sump as circulating water, a submersible pump pumps it through the nozzle hives for cleaning.  
Transparent housing cover gives maintenance personnel and operators an unobstructed view of all spray nozzles.  
Maintenance personnel can clean, replace, maintain and repair the nozzle hives as needed.  
Cleaning can be supported by special chemical formulations.  
Cleaning is carried out in a safe atmosphere when removed.  
 
With this application, TSK shows that the service concept is deeply internalized and produces innovative solutions with high practical benefits. 

Continuously refining technologies

For TSK, the state of the art is always only the basis and starting point for making further technological advances and refining technologies. In doing so, we always keep in mind that our systems are easy to maintain and robust in order to reliably maintain production. Resource conservation and environmental friendliness, wastewater-saving circuits, emissions into the air and noise emissions are just as important to us as the production quality for which the machines were designed. We support our customers in obtaining operator approvals for the processes on site.