Perfect protection via OSP 

The OSP process refines the surface of printed circuit boards with a thin, organic protective layer. It protects the copper surfaces from oxidation and corrosion and ensures excellent solderability even after a long storage period and before any assembly. The process is considered particularly efficient and environmentally friendly, as it does not require any harmful chemicals. Applied in the electronics industry, it increases the lifespan and reliability of printed circuit boards. 

TSK manufactures system modules for the OSP process in the highest quality and exactly according to customer requirements for stable production processes and maximum reliability. 

• Protects copper surfaces from oxidation 
• Ensures excellent solderability 
• Avoids harmful chemicals 
• Reduces production costs 
• Increases PCB reliability 

All-round carefree service

To ensure that our machines continue to work perfectly even after many years, we offer our customers a high-performance and experienced service. Whether maintenance, wear, repair or modernization, the TSK service ensures reliable production at all times. 
In addition, we also take care of machines for horizontal wet chemical processes that do not come from our company. Feel free to ask us!  

Effective protection  

The OSP process is ideal for the production of printed circuit boards in various industries such as consumer electronics, the automotive industry and medical technology. In production, the process protects sensitive components from corrosion and ensures that they function reliably over a long period of time. In the automotive industry, it enables the production of durable printed circuit boards that meet the high requirements that are common there. In medical technology, the OSP process ensures safe and highly reliable electronic components that are essential for critical applications. 

Clean OSP process steps 

The OSP procedure works in several steps. First, the system thoroughly cleans the copper surface and removes impurities. The organic protective layer is then applied evenly to the prepared surface very thinly. As a result, the layer dries quickly and hardens completely. This ensures the strength of the coating. These steps allow the PCB to be soldered excellently, and the process also protects the sensitive copper surfaces during further processing. 

Economical and environmentally friendly 

The OSP process is effective and economical. The low material costs and simple processes reduce the time spent in production. In addition, the use of harmful chemicals is eliminated, which makes the process more environmentally friendly. In addition, manufacturers benefit from lower disposal costs and a positive environmental balance. This makes the OSP process a forward-looking solution for the surface finishing of printed circuit boards. 

Continuously refining technologies

For TSK, the state of the art is always only the basis and starting point for making further technological advances and refining technologies. In doing so, we always keep in mind that our systems are easy to maintain and robust in order to reliably maintain production. Resource conservation and environmental friendliness, wastewater-saving circuits, emissions into the air and noise emissions are just as important to us as the production quality for which the machines were designed. We support our customers in obtaining operator approvals for the processes on site.